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TA84005F/FG
TOSHIBA Bipolar Linear IC Silicon Monolithic
TA84005F/FG
Three-Phase Wave Motor Driver IC
The TA84005F/FG is a three-phase wave motor driver IC. Used with a three-phase sensorless controller (TB6548F/FG), the TA84005F/FG can provide PWM sensorless drive for three-phase brushless motors.
Features
* * * * * * Built-in voltage detector Overcurrent detector incorporated Overheating protector incorporated Multichip (MCH) structure Uses Pch-MOS for the upper output power transistor Rated at 25 V/1.0 A Package: SSOP30-P-375-1.00 Weight: 0.63 g (typ.)
Note 1: This product has a multichip (MCP) structure utilizing Pch-MOS technology. The Pch-MOS structure is sensitive to electrostatic discharge and should therefore be handled with care.
TA84005FG: The TA84005FG is Pb-free product. The following conditions apply to solderability: *Solderability 1. Use of Sn-63Pb solder bath *solder bath temperature = 230C *dipping time = 5 seconds *number of times = once *use of R-type flux 2. Use of Sn-3.0Ag-0.5Cu solder bath *solder bath temperature = 245C *dipping time = 5 seconds *number of times = once *use of R-type flux
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Block Diagram
VCC COMP N VM VZ
IN_UP IN_VP
Pin voltage detector Pch-MOSFET x 3
IN_WP Control circuit IN_UN IN_VN IN_WN OUT_U OUT_V Motor OUT_W
Overheating protector
RF
VISD1 ISD Overcurrent detector
S_GND
P_GND
VISD2
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Pin Assignment

LV LW OUT_W LA0 LA1 PWM CW_CCW NC SEL_OUT NC SEL_LAP NC XT XTin GND 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 WAVE OC OUT_WN OUT_WP NC OUT_VN NC OUT_VP NC OUT_UN OUT_UP VDD VM2 VZ RF1 P_GND1 NC ISD IN_WN IN_WP IN_VN IN_VP IN_UN IN_UP
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
OUT_V VM1 OUT_U Lu NC RF2 P_GND2 NC NC VISD2 VISD1 COMP N VCC S_GND
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Pin Description
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 Pin Symbol LV LW OUT_W VM2 VZ RF1 P_GND1 NC ISD IN_WN IN_WP IN_VN IN_VP IN_UN IN_UP S_GND VCC N COMP VISD1 VISD2 NC NC P_GND2 RF2 NC Lu OUT_U VM1 OUT_V Pin Function V-phase output upper Pch gate pin W-phase output upper Pch gate pin W-phase output pin Motor drive power supply pin Reference voltage pin Output current detection pin Power GND pin Not connected Overcurrent detection output pin W-phase upper drive input pin W-phase lower drive input pin V-phase upper drive input pin V-phase lower drive input pin U-phase upper drive input pin U-phase lower drive input pin Signal GND pin Control power supply pin Mid-point pin Location detection signal output pin Overcurrent detection input pin 1 Overcurrent detection input pin 2 Not connected Not connected Power GND pin Output current detection pin Not connected U-phase upper output Pch gate pin U-phase output pin Motor drive power supply pin V-phase output pin Leave open. Connects motor. Externally connects to the VM2 pin. Connects the motor. VCC (opr) = 4.5 to 5.5 V Mid-point potential confirmation pin; left open Connects to the WAVE pin of the TB6548F/FG. Externally connects to the RF2 pin. Connect a capacitor between this pin and GND. Internal resistor and capacitor used to reduce noise. Externally connects to the P_GND1 pin. Externally connects to the RF1 pin. Connect a detection resistor between this pin and GND. Leave open. Leave open. Connects motor. Externally connects to VM1. Used for the VM drop circuit reference voltage when VM (max) > 22 V. = Left open when VM (max) < 22 V. = Externally connected to RF2. (Connect a detection resistor between this pin and GND.) Externally connects to P_GND2. Connects to the OC pin of the TB6548F/FG. Connects to the OUT_WN pin of the TB6548F/FG; incorporates pull-down resistor. Connects to the OUT_WP pin of the TB6548F/FG; incorporates pull-up resistor. Connects to the OUT_VN pin of the TB6548F/FG; incorporates pull-down resistor. Connects to the OUT_VP pin of the TB6548F/FG; incorporates pull-up resistor. Connects to the OUT_UN pin of the TB6548F/FG; incorporates pull-down resistor. Connects to the OUT_UP pin of the TB6548F/FG; incorporates pull-up resistor. Remarks
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Maximum Ratings (Ta = 25C)
Characteristic Motor power supply voltage Control power supply voltage Output current Input voltage Symbol VM VCC IO VIN Pd Topr Tstg Rating 25 7 1.0 GND - 0.3 ~VCC + 0.3 V 1.1 (Note 2) 1.4 (Note 3) Operating temperature Storage temperature -30~85 -55~150 C C Unit V V A/phase V
Power dissipation
W
Note 2: Standalone Note 3: When mounted on a PCB (50 x 50 x 1.6 mm; Cu area, 30%)
Recommended Operating Conditions (Ta = -30~85C)
Characteristic Control power supply voltage Motor power supply voltage Output current Input voltage Chopping frequency Vz current Symbol VCC VM IO VIN fchop IZ Test Circuit Test Conditions Min 4.5 10 GND 15 Typ. 5.0 20 20 Max 5.5 22 0.5 VCC 50 1.0 Unit V V A V kHz mA
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Electrical Characteristics (Ta = 25C, VCC = 5 V, VM = 20 V)
Characteristic Symbol VIN (H) VIN (L) IIN1 (H) Test Circuit 1 1 2 VIN = 5 V, IN_UP, IN_VP, IN_WP 2 VIN = 5 V, IN_UN, IN_VN, IN_WN 2 VIN = GND, IN_UN, IN_VN, IN_WN 2 VIN = GND, IN_UP, IN_VP, IN_WP 3 Upper phase 1 ON, lower phase 1 ON, output open Upper phase 2 ON, synchronous regeneration mode, output open All phases OFF, output open Upper phase 1 ON, lower phase 1 ON, output open Upper phase 2 ON, synchronous regeneration mode, output open All phases OFF, output open IO = 0.5 A IO = 0.5 A, bi-directional IF = 0.5 A IF = 0.5 A VM = 20 V VRF = 0 V VM = 20 V VRF = 0 V IOL = 1 mA IOH = 0.1 mA IZ = 0.5 mA, Tj = 25C Tj Pch-MOS 9.88 8.0 13.0 300 450 600 1 Test Conditions IN_UP, IN_VP, IV_WP IN_UN, IN_VN, IN_WN GND 0.8 20 Min 2.5 Typ. Max 5.0 Unit
Input voltage
V
IIN2 (H) Input current IIN1 (L)
300
450
600 A
IIN2 (L) ICC1
ICC2 ICC3 IM1
3 3 3
7.0 6.0 2.0
12.0 11 3.5
Power supply current
mA
IM2 IM3 Lower output saturation voltage Upper output ON-resistance Lower diode forward voltage Upper diode forward voltage Mid-point voltage VSAT Ron VF (L) VF (H) VN
3 3 4 5 6 7 8
2.0 1.8 1.0 0.65 1.2 0.9 10.4
3.5 3.2 1.5 1.0 1.6 1.4 10.92 V V V V
Pin voltage detection level
VCMP VOL (CMP) ROH (CMP)
9 9 9 10 10 10 11 12 13
9.88 GND 7 0.45 4.5 14 20.9
10.4 10 0.5 20 22.0 180 30 0 0
10.92 0.5 13 0.55 5.0 26 23.1 100 50
V V k V V k V C C A
Pin voltage detection output voltage Overcurrent detection level Overcurrent detection output voltage
VRF VOH (ISD) ROL (ISD)
Reference voltage TSD temperature TSD hysteresis width Output leakage current
VZ TSD T IL (H) IL (L)
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Functions
Input IN-P High Low High Low IN-N High High Low Low Upper Power Transistor ON ON OFF OFF Output Lower Power Transistor OFF ON OFF ON High Prohibit mode High impedance Low (Note 4)
Connecting the TB6548F/FG (or TB6537P/PG/F/FG) to the TA84005F/FG allows electric motors to be controlled by PWM. Note 4: In Prohibit Mode, the output power transistor goes into vertical ON mode and through current may damage the circuit. Do not use the TA84005F/FG in this mode. This mode is not actuated when the TA84005F/FG is connected to the TB6548F/FG or TB6537P/PG/F/FG, but can be triggered by input noise during standalone testing.

VM
OUT-P Low active TB6548F/FG (TB6537P/PG /F/FG)
IN-P
OUT
OUT-N High active
IN-N

Connecting the TA84005F/FG to the TB6537P/PG/F/FG controls the lower PWM. At chopping ON, the diagonally output power transistors are ON. At chopping OFF, the lower transistor is OFF, regenerating the motor current via the upper diode (incorporating the Pch-MOS).
VM ON Pch-MOS VOUT OFF OFF When chopping is ON When chopping is OFF
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Connecting the TA84005F/FG to the TB6548F/FG controls the synchronous rectification PWM. At chopping OFF, power dissipation is reduced by operating the Pch-MOS in reverse and regenerating the motor's current.
VM ON Pch-MOS VOUT OFF When chopping is ON When chopping is OFF

When controlling synchronous rectification PWM
IN-P
IN-N
VOUT
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Equivalent Circuit

* * * Input to the VISD1 pin the voltage generated at the overcurrent detection resistor RF connected to the RF pin. At chopping ON, voltage spikes at the RF pin as a result of the Pch-MOS output capacitance. To cancel the spike, externally connect a capacitor to the VISD2 pin (10 k resistor built-in). If the VISD2 pin voltage exceeds the internal reference voltage (VRF = 0.5 V), the overcurrent detection output ISD pin goes High. Inputting the ISD pin output to the TB6537P/PG/F/FG or TB6548F/FG OC pin limits the PWM ON time and the current at the ISD output rising edge.
VCC VISD1 10 k VISD2 External capacitor 20 k (typ.) 0.5 V (typ.) ISD

* The pin voltage detector outputs the result of OR-ing the output pin voltages and the virtual mid-point N voltage to determine the majority. (If at least two phases of the three-phase output are greater than the mid-point potential, the detector outputs "Low". Conversely, if at least two phases are smaller than the mid-point potential, the circuit outputs "High".)
VCC
10 k (typ.)
Majority-determining OR data
COMP
GND
*
With the virtual mid-point potential VN used as the reference for the pin voltage detection circuit considered as half the voltage applied to the motor, then VN = [ (VM - Ron (upper) *IO) - (Vsat (lower) + VRF) ]/2 + Vsat + VRF = [VM - VRF + Vsat (lower) - Ron (upper) *IO]/2 + VRF. Here, assuming that Vsat (lower) - Ron (upper) *IO VF, - we have set the following: VN = [VM - VRF + VF]/2 + VRF

* * Automatic restoration Temperature hysteresis supported TSD (ON) = 180C TSD (HYS) = 30C TSD (OFF) = 150C
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* Incorporate a Zener diode and make the external connections shown in the diagram below. Design the device so that the voltage applied to the VM is clamped at 22 V below the maximum operating power supply voltage. A capacitor is needed to control the effect of the counter-electromotive force. Verification is particularly necessary when the motor current is large at startup or at shutdown (output OFF). 24 V Vz pin fluctuation width 20.9 V to 23.1 V Due to the temperature characteristics (3.5 x 3 mV/C), the following applies at an ambient temperature of 85C: VZ Vz (max) = 23.1 + (85 - 25) x 3.5 x 3 mV = 23.73 V By taking the measures shown in the diagram on the right to bring the voltage down to 22 V, the following becomes the case: Vz (max) = 23.73 - (0.7 - 2 mV x (85 - 25) ) x 3 = 21.99 V
*
VM
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Example of Application Circuit
VDD = 5 V VM = 20 V
Location detection signal WAVE PWM signal COMP
M TB6548F/FG TA84005F/FG
RF VISD1 OC Overcurrent detection signal GND S_GND P_GND ISD VISD2
0.01 F
Note 5: A short circuit between the outputs, or between output and supply or ground may damage the device. Design the output, VCC, VS, and GND lines so that short circuits do not occur.
11
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TA84005F/FG
Test Circuit 1: VIN (H), VIN (L)
20 V 17 1 2 27 4 29 19 10 11 12 13 14 15 TA84005F/FG 28 18 5V
500
30 3 V 6 25 V V
2.5 V
0.8 V
16
7
24
9
20
21
Input VIN = 0.8 V/2.5 V, measure the output voltage, and test the function.
Test Circuit 2: IIN (H), IIN (L)
17
1 2 27
4 29 19
10 11 12 13 14 15 TA84005F/FG
18
28
30 3 6 25
A 5V
A 16 7 24 9 20 21
20 V
5V
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Test Circuit 3: ICC1, ICC2, ICC3, IM1, IM2, IM3
ICC 5V A 17 1 2 27 4 29 19 10 11 12 13 14 15 TA84005F/FG 28 18 A IM 20 V 30 3 6 25 2.5 V 0.8 V 16 7 24 9 20 21 19 10 11 12 13 14 15 TA84005F/FG 28 18 30 3 Vsat V 6 25 16 7 24 9 20 21 20 V 17 1 2 27 4 29
ICC1, IM1: upper phase 1 ON, lower phase 1 ON (e.g., U-phase: H; V-phase: L; W-phase: Z) ICC2, IM2: upper phase 1 ON, synchronous regeneration mode (e.g., U-phase: H; V-phase: H; W-phase: Z) ICC3, IM3: all phases OFF
Test Circuit 4: Vsat
5V
0.5 A
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Test Circuit 5: Ron
17
1 2 27
4 29 19 V1 V 0.5 A Ron = V1/0.5 3 6 25 0.5 A
10 11 12 13 14 15 TA84005F/FG
18
28
30
Test Circuit 6: VF (L)
17 1 2 27 4 29 19 10 11 12 13 14 15 TA84005F/FG 28 18
5V
16
7
24
9
20
21
30 3 VF V 6 25
16
7
24
9
20
21
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20 V
5V
TA84005F/FG
Test Circuit 7: VF (H)
17
1 2 27
4 29 19 VF V 0.5 A
10 11 12 13 14 15 TA84005F/FG
18
28
30 3 6 25
16
7
24
9
20
21
Test Circuit 8: VN
20 V 17 1 2 27 4 29 19 10 11 12 13 14 15 TA84005F/FG 28 VN V 30 3 6 25 16 7 24 9 20 21 18
5V
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Test Circuit 9: VCMP, VOL (CMP), ROH (CMP)
20 V 17 1 2 27 4 29 19 10 11 12 13 14 15 TA84005F/FG 28 18 SW1 V V2 A B 10 k 30 3 6 25 5V 16 7 24 9 20 21 10.92 V 0.1 mA 5V 0.55 V 9.88 V 19 10 11 12 13 14 15 TA84005F/FG 28 18 30 3 6 25 16 7 24 9 20 21 SW2 V V3 A 0.45 V B 100 k 20 V 17 1 2 27 4 29 5V
(1) (2)
Where output phase 2 is High (10.92 V) and phase 1 is Low (= 9.88 V), set SW1 = A and measure V2 = VOL (CMP). Where output phase 1 is High (10.92 V) and phase 2 is Low (9.88 V), set SW1 = B and confirm that 5 V x 10 k/(10 k + 13 k) < V2 < 5 V x 10 k/(10 k + 7 k).
Test Circuit 10: VRF, VOH (ISD), ROL (ISD)
5V
(1) (2)
Where VISD = 0.55 V, set SW2 = A and measure V3 = VOH (ISD). Where VISD = 0.45 V, set SW2 = B and confirm that 5 V x 14 k/(100 k + 14 k) < V3 < 5 V x 26 k/(26 k + 100 k).
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Test Circuit 11: VZ
V
VZ
0.5 mA
17
1 2 27 5
4 29 19
10 11 12 13 14 15 TA84005F/FG
18
28
30 3 6 25
16
7
24
9
20
21
Test Circuit 12: IL (H)
25 V 17 1 2 27 4 29 19 10 11 12 13 14 15 TA84005F/FG 28 18 Connect N pin to -0.3 V 30 3 A 6 25 5V 16 7 24 9 20 21
5V
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Test Circuit Test Circuit 13: IL (L)
17
1 2 27
4 29 19
10 11 12 13 14 15 TA84005F/FG
18 A 28
30 3 6 25
5V
16
7
24
9
20
21
18
25 V
5V
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TA84005F/FG
Package Dimensions
Weight: 0.63 g (typ.)
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Notes on Contents 1. Block Diagrams
Some functional blocks, circuits, or constants may be omitted or simplified in the block diagram for explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Maximum Ratings
The absolute maximum ratings of a semiconductor device are a set of specified parameter values that must not be exceeded during operation, even for an instant. If any of these ratings are exceeded during operation, the electrical characteristics of the device may be irreparably altered and the reliability and lifetime of the device can no longer be guaranteed. Moreover, any exceeding of the ratings during operation may cause breakdown, damage and/or degradation in other equipment. Applications using the device should be designed so that no maximum rating will ever be exceeded under any operating conditions. Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set forth in this document.
5. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially in the phase of mass production design. In furnishing these examples of application circuits, Toshiba does not grant the use of any industrial property rights.
6. Test Circuits
Components in test circuits are used only to obtain and confirm device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure in application equipment.
Handling of the IC
Ensure that the product is installed correctly to prevent breakdown, damage and/or degradation in the product or equipment.
Overcurrent Protection and Heat Protection Circuits
These protection functions are intended only as a temporary means of preventing output short circuits or other abnormal conditions and are not guaranteed to prevent damage to the IC. If the guaranteed operating ranges of this product are exceeded, these protection features may not operate and some output short circuits may result in the IC being damaged. The overcurrent protection feature is intended to protect the IC from temporary short circuits only. Short circuits persisting over longer periods may cause excessive stress and damage the IC. Systems should be configured so that any overcurrent condition will be eliminated as soon as possible.
Counter-electromotive Force
When the motor reverses or stops, the effect of counter-electromotive force may cause the current to flow to the power source. If the power supply is not equipped with sink capability, the power and output pins may exceed the maximum rating. The counter-electromotive force of the motor will vary depending on the conditions of use and the features of the motor. Therefore make sure there will be no damage to or operational problem in the IC, and no damage to or operational errors in peripheral circuits caused by counter-electromotive force.
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RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice.
030619EBA
* The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The products described in this document are subject to the foreign exchange and foreign trade laws. * TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced and sold, under any law and regulations.
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